FF200r12ks4 200 a Dual IGBT Modules with Fast IGBT2 Available with Thermal Interface Material High

Basic Info.

Model NO.	FF200R12KS4
Model	ST
Batch Number	2010+
Brand	Infineon
IC(Nom) / If(Nom)	200 a
Technology	IGBT2
Configuration	Dual
Voltage	1200V
Transport Package	Carton
Trademark	Infineon
Origin	Germany
Production Capacity	50000 PC/ Year

Product Description

Parametrics	FF200R12KS4
Configuration	Dual
Dimensions (width)	61.4 mm
Dimensions (length)	106.4 mm
Features	Fast short tail IGBT chip
Housing	62 mm
IC(nom) / IF(nom)	200 A
IC max	200 A
Qualification	Industrial
Technology	IGBT2 Fast
VCE(sat) (Tvj=25°C typ)	3.2 V
VF (Tvj=25°C typ)	2 V
Voltage Class max	1200 V

MODEL:

FF100R12KS4

FF150R12KS4

FF200R12KS4

FF300R12KS4

Infineon 62 mm 1200 V, 200 A dual IGBT modules with fast IGBT2 for high-frequency switching is the right choice for your design. Also available with Thermal Interface Material.

Summary of Features

• High short circuit capability
• Self limiting short circuit current
• Low switching losses
• Unbeatable robustness
• V_CEsat with positive temperature coefficient
• Package with CTI > 400
• High creepage and clearance distances
• Isolated base plate
• Copper base plate
• Standard housing

Benefits

• Flexibility
• Optimal electrical performance
• Highest reliability

Applications
Uninterruptible Power Supplies (UPS)

IGBT Discretes, Press Pack,power modules and even stack solutions in different voltage- and current classes.

Our IGBT product selection provides a broad variety of different devices. These products address a wide range of applications in the field of automotive, traction, energy transmission, industrial and consumer systems. Our solutions offer very low power losses in the forward and blocking state, require only low drive power and have a high efficiency. The IGBTs can withstand voltages up to 6.5 kV and operate at a switching frequency from 2 kHz to 50 kHz.

General description of our IGBT portfolio

We offer a broad portfolio of IGBT chips assembled in discrete plastic packages, so called Discretes IGBTs, which are available as Single IGBTs and co-packed with freewheeling Diode. This devices are suitable for applications such as General Purpose Inverters, Solar Inverters, UPS, Induction Heating, Major Home Appliances, Welding and SMPS. Benefits of Discretes IGBT are high current density and low power dissipation resulting in higher efficiency and smaller heat sink to allow lower overall system cost.
Larger arrangements that form basic building blocks of power electronic equipment are considered Power Modules usually combining IGBT and diode dies in various topologies. With the help of high performance components, these power modules can cope with the needs of highest power applications. From all-in-one power integrated modules with rectifier, brake chopper and to inverter part, Infineon products cover a range from only hundreds of watts to several megawatts. General purpose drives, servo-units and renewable energy applications like solar inverters or wind applications benefit from the outstanding performance, efficiency and longevity of these highly reliable products.
The HybridPACK™ family as a special product series with automotive qualification is available to support the designer's efforts in electric mobility. Infineon further supports the automotive industry, providing a variety of discrete IGBT power semiconductors qualified according to AECQ101.
To ease setting up a laboratory experiment or a first prototype, Infineon helps by providing evaluation boards for most of the products to accelerate development cycles. Thus, conclusive results can be generated within the shortest possible time.

COMPANY PROFILE
Shenzhen Botong Electric Co., Ltd. is a professional distributor of imported branded products, located at 7S Yindu, Building 100, No. 4 Zhonghang Road, Huahang Community, Huaqiang North Street, Futian District, Shenzhen. Headquartered in Beijing (established in 2006), with offices in Shandong and Hebei. Its business involves power electronic components and supporting PI drive boards, LEM sensors, fans, and capacitors. Our company acts as an agent for the distribution of IGBT, IPM, PIM, rectifier bridge, thyristor, diode, etc. in Infineon, Semi kron, HITACHI, Fuji, Mitsubishi, SanRex, IXYS, etc; Ximenkang, PI driver board; Liteon optocoupler; Japan Jianzao IDC driver module; Electrolytic capacitor; Electronic components such as absorption capacitors (CAPSIT). Mainly used in: industrial automation, high-voltage inverter, UPS, inverter welding machine, inverter, high-frequency induction heating, commercial induction cooker, inverter power supply, wind and solar power generation, electric locomotive, electroplating power supply, soft start and other fields. We meet customer needs with excellent product performance, high reliable quality, superior service, the most favorable price and delivery time.
Storage & Delivery

SHIPPING
1.FEDEX/DHL/UPS for samples.2.By Sea for batch goods.3.Customers specifying freight forwarders or negotiable shipping methods.
FAQ
1.Q :What's the MOQ. Can I get a sample of free? A : MOQ, according to the actual situation. We can offer a sample of free. Please, friendly bear the shipping cost. 2.Q : When can i get the quotation? A : We usually quote within 24 hours after getting your detailed requirements, like size, quantity, etc. 3.Q : What is your payments terms? A : We can accept 30% deposit, 70% balance to be against the BL copy or by LC, or other payment terms. 4.Q : What is your terms of delivery? A : We accept FOB, CFR, CIF, EXW, etc. You can choose the most convenient way for you. Besides that, we can also shipping by Air and Express.